Upholding the philosophy of “quality first”, Hengshi Technology is committed to providing its clients with the highest quality electronic components. We conduct components inspection at our QC inspection Centers.
Detect missing or incorrect dies, lack of bond wires, inaccurate pin outs and pin impedance variations Return simple pass or fail results after testing Offer a high level of confidence in the authenticity of components.
Utilizing state of the art high resolution microscopes,Hengshi Technology team conduct visual inspection analysis at our house lab.The parts would be fully checked for surface analysis, marking on the parts, date code, COO, pins status as well as the received quantity, inside packing, humidity indicator, desiccant requirements and proper outer packaging. It is quick and efficient to complete visual inspection which would help you to get further knowledge of the parts surface status.
Solderbility Test has the priority in evaluation of the parts with leaded type electrodes. Evaluation would be conducted for the solderbility of electronic components according to the principle of “wetting balance”.
Using instruments to corrode the outer package of the parts to check whether there is a wafer existed, the size of the wafer, the manufacturer’s logo, the copyright year, and the wafer code to determine the authenticity of the chip.
Testing the full functionality of the parts which contained the testing of DC parameters to ensure that the parts has all the required functionality, based on the relevant datasheet.
X-ray testing is a real-time non-destructive analysis to check the internal hardware of the component. It mainly focus on checking the lead frame of the chip, wafer size, gold wire bonding diagram, ESD damage and holes. Customers can provide usable samples or compare and check the remaining products purchased in the previous period.